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Model PS400

Flatness Measurement and Analysis System

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The TherMoiré PS400 is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré PS400 captures a complete history of a sample's behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS400, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system, improving its reliability and operating performance. The PS400 is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS400 further extends the capabilities of the PS200 by:

  • Increasing the field of view by 4X.
  • Expanding the Convective Module to capabilities to 200 mm x 200 mm parts.
  • Providing 2X faster heating and cooling rates.
  • Allowing for multi-part inspection and trending analysis on the production floor.
  • Offering additional characterization techniques such as Digital Image Correlation (DIC) for in-plane metrology and Micro Fringe Projection for small form factor measurement.


The PS400 can be used in the laboratory:
  • Pb-Free processing implementation
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile optimization
  • Supplier performance and conformity monitoring
  • Evaluation of component-substrate seating plane interconnect


The PS400 can also be used on the production floor:
  • Quality assurance/quality control
  • Lot-to-lot trending analysis
  • Real-time process monitoring
  • Statistical process control (SPC) analysis
  • Supplier performance and conformity monitoring

U.S. Patents issued: 5,601,364
U.S. Patents pending: 5,835,223 and 5,969,819





PS400 Add-On Modules

Convective Module

DIC Module

CoolBoost Module

MP10 Module