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Model J5000
Production Level Automated Flatness Inspection SystemDownload a PDF version of the brochure
The J5000 is the latest advancement of the LineMoiré
product line offering groundbreaking capabilities
in the area of high volume automated flatness
measurement Based on shadow Moiré - a
powerful, full-field, non-contact measurement
technique - LineMoiré measurement systems
are production-level tools used for rapid analysis
of substrate/material topography.
The J5000 builds on this
technology by allowing for in-JEDEC tray inspection
of parts at data’ acquisition speeds of
approximately one second per tray and z-axis
sensitivities of 2~5 micron or better. The integrated
software package can then assign pass/fail decisions
on each part in the tray based on the user’s
specification. Finally, and perhaps most importantly,
the automated handling system can replace “bad”
parts in the tray with known “good”
parts, and then stack “good” trays
and bad trays separately.
The J5000’s ability
to analyze an entire tray of parts, combined
with tray stacking/destacking capability, allow
the system to measure up to 5000 parts/hour
(estimate based on 24 parts/tray, 6% failure
rate). With higher capacity trays and/or lower
failure rates, output can be in excess of 5,000
parts/hour.
Applications for flatness measurement include:
- Flip chip substrate measurement (level I and level II interconnect areas)
- Finished packages, lCs
- Package lid, cavity and flange flatness
- Heat sinks
- Substrate “out of pocket”, tilt and missing part determination
- Die-to-substrate tilt (pre wire bond; pre/post underfill cure)
- Die flatness (post underfill cure)
