Electronic Assembly

"Junk in equals junk out." Substrate flatness compliance is ever more critical for successful assembly operations on both a global (whole board) and local (key component site) basis. Akrometrix' product and software offerings provide a comprehensive, quantitative means to achieve measured success on either a supplier management (sampling) or process (100%) inspection basis.

100% Incoming Inspection of PCBs (LineMoiré) - Inspecting incoming boards can screen for both global (overall bow and twist requirements) and local (individual component site coplanarity) warpage. Bad product can be identified and returned to the vendor before causing assembly yield problems. Shadow moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for PCBs up to panel size.

100% Incoming Inspection of Packaged Components (LineMoiré) - Bad incoming components can be identified and returned to the vendor before causing assembly yield problems. Shadow moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of final products.

Adaptive Processing (LineMoiré) - Measurement of PCB flatness at the beginning of the line provides feed-forward information that can be used to adjust solder paste printing and component placement processes to increase yield and reduce rework.

Mid-Process Inspection (LineMoiré) - Double-sided reflow processes pose special problems when substrate flatness is adversely affected by the first reflow pass. Identifying and culling warpage failures before adding the typically higher value components on the top side can greatly reduce waste and rework costs.

Process Development (TherMoiré) - Reflow performance of new PCBs and components can be tested without tying up the production line, reducing new product introduction time and cost. Thermal time-temperature profiles can be optimized in the laboratory.

Assembly Yield and Reliability Investigation (TherMoiré) - Yield and reliability problem for a product already in production translate to increased costs associated with waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage assists root cause analysis and identifying the responsible party in a complex multi-organization supply chain. Localized heating effects during rework can be measured and debugged.

Traceability - (TherMoiré, LineMoiré) - Advanced software and data management tools offered by Akrometrix enable statistical process control monitoring, trending and traceability. On-site or remote monitoring and reporting can provide valuable insight and time savings for customer critical response requirements.